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document number: mpxa6115a rev 7, 05/2011 freescale semiconductor technical data ? freescale semiconductor, inc., 2007-2011. all rights reserved. high temperature accuracy integrated silicon pressure sensor for measuring absolute pressure, on-chip signal conditioned, temperature compensated and calibrated the mpxxx6115a series sensor integrates on-chip, bipolar op amp circuitry and thin film resistor networ ks to provide a high output signal and temperature compensation. the small form factor and high reliability of on- chip integration make the pressure se nsor a logical and economical choice for the system designer. the mpxxx6115a series piezoresistive transducer is a state-of-the-art, monolithic, signal conditione d, silicon pressure sensor. this sensor combines advanced micromachining techniques, th in film metallization, and bipolar semiconductor processing to provide an accurate, high level analog output signal that is proportional to applied pressure. features ? resistant to high humidity and common automotive media ? improved accuracy at high temperature ? available in small and super small outline packages ? 1.5% maximum error over 0 to 85 c ? ideally suited for mi croprocessor or microcontroller-based systems ? temperature compensated from -40 to +125 c ? durable thermoplastic ( pps) surface mount package ordering information device name package option case no. # of ports pressure type device marking none single dual gauge differential absolute small outline package (mpxa6115a series) mpxa6115a6u rails 482 ? ? mpxa6115a mpxa6115a6t1 tape and reel 482 ? ? mpxa6115a mpxa6115ac6u rails 482a ? ? mpxa6115a mpxa6115ac6t1 tape and reel 482a ? ? mpxa6115a mpxa6115ac7u rails 482c ? ? mpxa6115a small outline package (media resistant gel) (mpxaz6115a series) mpxaz6115a6u rails 482 ? ? mpxaz6115a mpxaz6115ac6u rails 482a ? ? mpxaz6115a mpxaz6115ac6t1 tape and reel 482a ? ? mpxaz6115a mpxaz6115ap trays 1369 ? ? mpxaz6115a mpxaz6115apt1 tape and reel 1369 ? ? mpxaz6115a super small outline package (mpxh6115a series) mpxh6115a6u rails 1317 ? ? mpxh6115a mpxh6115a6t1 tape and reel 1317 ? ? mpxh6115a mpxh6115ac6u rails 1317a ? ? mpxh6115a mpxh6115ac6t1 tape and reel 1317a ? ? mpxh6115a mpxa6115a series mpxh6115a MPXHZ6115A 15 to 115 kpa (2.2 to 16.7 psi) 0.2 to 4.8 v output mpxaz6115a application examples ? aviation altimeters ? industrial controls ? engine control/manifold absolute pressure (map) ? weather station and weather reporting device barometers
mpxa6115a sensors 2 freescale semiconductor small outline package (media resistant gel) (MPXHZ6115A series) MPXHZ6115A6u rails 1317 ? ? MPXHZ6115A MPXHZ6115A6t1 tape and reel 1317 ? ? MPXHZ6115A MPXHZ6115Ac6u rails 1317a ? ? MPXHZ6115A MPXHZ6115Ac6t1 tape and reel 1317a ? ? MPXHZ6115A ordering information small outline packages super small outline packages mpxa6115a6u/t1 mpxaz6115a6u case 482 mpxa6115ac6u/t1 mpxaz6115ac6u/t1 case 482a mpxh6115a6u/t1 MPXHZ6115A6u/t1 case 1317 mpxh6115ac6u/t1 MPXHZ6115Ac6u/t1 case 1317a mpxa6115ac7u case 482c mpxaz6115ap/t1 case 1369
mpxa6115a sensors freescale semiconductor 3 operating characteristics maximum ratings table 1. operating characteristics (v s = 5.0 vdc, t a = 25 c unless otherwise noted, p1 > p2) characteristic symbol min typ max unit pressure range p op 15 ? 115 kpa supply voltage (1) v s 4.75 5.0 5.25 vdc supply current i o ?6 . 01 0m a d c minimum pressure offset (2) (0 to 85 c) @ v s = 5.0 volts v off 0.133 0.200 0.268 vdc full scale output (3) (0 to 85 c) @ v s = 5.0 volts v fso 4.633 4.700 4.768 vdc full scale span (4) (0 to 85 c) @ v s = 5.0 volts v fss 4.433 4.500 4.568 vdc accuracy (5) (0 to 85 c) ??? 1.5 %v fss sensitivity v/p ? 45.0 ? mv/kpa response time (6) t r ?1 . 0?m s warm-up time (7) ??2 0?m s offset stability (8) ?? 0.25 ? %v fss 1.device is ratiometric within this specified excitation range. 2.offset (v off ) is defined as the output voltage at the minimum rated pressure. 3.full scale output (v fso ) is defined as the output voltage at the maximum or full rated pressure. 4. full scale span (v fss ) is defined as the algebraic difference between the output volt age at full rated pressure and the output voltage at the minimum rated pressure. 5.accuracy is the deviation in actual outpu t from nominal output over the entire pressure range and temperature range as a perc ent of span at 25 c due to all sources of error including the following: linearity: output deviation from a straight line relations hip with pressure over t he specified pressure range. temperature hysteresis: output deviation at any temperature with in the operating temperature range, after the temperature is cy cled to and from the minimum or maximum operating temperatur e points, with zero differential pressure applied. pressure hysteresis: output deviati on at any pressure within the specified range, when this pressure is cycled to and from minim um or maximum rated pressure at 25 c. tcspan: output deviation over the temperature range of 0 to 85 c, relative to 25 c. tcoffset: output deviation with minimum pres sure applied, over the temperature range of 0 to 85 c, relative to 25 c. 6.response time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when s ubjected to a specified step change in pressure. 7.warm-up time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized. 8.offset stability is the product's output deviation when subjected to 1000 cycles of pulsed pressure, temperature cycling with bias test. table 2. maximum ratings (1) rating symbol value units maximum pressure (p1 > p2) p max 400 kpa storage temperature t stg -40 to +125 c operating temperature t a -40 to +125 c output source current @ full scale output (2) i o +0 . 5m a d c output sink current @ minimum pressure offset (2) i o -- 0 . 5m a d c 1.exposure beyond the specified limits may c ause permanent damage or degradation to the device. 2. maximum output current is controlled by effective impedance from v out to gnd or v out to v s in the application circuit.
mpxa6115a sensors 4 freescale semiconductor figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. figure 1. fully integrated pressure sensor schematic on-chip temperature compensation and calibration figure 2 illustrates the absolute sensing chip in the basic super small outline chip carrier (case 1317). figure 3 shows a typical application circuit (output source current operation). figure 4 shows the sensor output signal relative to pressure input. typical minimum and maximum output curves are shown for operation over 0 to 85c temperature range. the output will saturate outside of the rated pressure range. a fluorosilicone gel isolates the die surface and wire bonds from the environment, while a llowing the pressure signal to be transmitted to the silicon diaphragm. the mpxxx6115a series pressure sensor operating characteristics, internal reliability and qualification tests are based on use of dry air as the pressure media. media other than dry air may have adverse effects on sensor performance and long-term reliability. contact the factory for information regarding media compatibility in your application. figure 2. cross sectional diag ram ssop/sop (not to scale) figure 3. typical application circuit (output source current operation) pins 1, 5, 6, 7, and 8 are no connects sensing element v out v s gain stage #2 gnd and ground reference shift circuitry thin film temperature compensation and gain stage #1 3 2 4 wire bond stainless steel cap thermoplastic case die bond sealed vacuum reference fluorosilicone gel die coat lead frame absolute element p1 die v s pin 2 +5.0 v gnd pin 3 v out pin 4 mpxxx6115a to adc 100 nf 51 k 47 pf
mpxa6115a sensors freescale semiconductor 5 figure 4. output vs. absolute pressure output (volts) 5.0 4.5 4.0 3.5 3.0 pressure (ref: to sealed vacuum) in kpa max min 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100 105 2.5 2.0 1.5 1.0 0.5 0 110 transfer function: v out = v s * (.009*p-.095) error v s = 5.0 vdc temp = 0 to 85oc 115 120 typ transfer function (mpxxx6115a) nominal transfer value: v out = v s x (0.009 x p - 0.095) (pressure error x temp . factor x 0.009 x v s ) v s = 5.0 0.25 vdc temperature error band mpxxxa6115a series break points temp multiplier - 40 3 0 to 85 1 125 1.75 temperature in co 4.0 3.0 2.0 0.0 1.0 -40 -20 0 20 40 60 14012010080 temperature error factor note: the temperature multiplier is a linear response from 0oc to -40oc and from 85oc to 125oc pressure error band error limits for pressure 3.0 2.0 1.0 -1.0 -2.0 -3.0 0.0 20 pressure (in kpa) pressure error (kpa) 15 to 115 (kpa) 1.5 (kpa) 40 60 80 100 120 pressure error (max)
mpxa6115a sensors 6 freescale semiconductor minimum recommended footprint for small and super small packages surface mount board la yout is a critical portion of the total design. the footprint for the semiconductor package must be the correct size to ensure proper solder connection interface between the board and the package. with the correct pad geometry, the packages will self-align when subjected to a solder reflow process. it is always recommended to fabricate boards with a solder mask layer to avoid bridging and/or shorting between solder pads, especially on tight tolerances and/or tight layouts. figure 5. sop footprint (case 482) figure 6. ssop footprint (case 1317 and 1317a) 0.660 16.76 0.060 typ 8x 1.52 0.100 typ 2.54 0.300 7.62 inch mm 0.100 typ 8x 2.54 0.027 typ 8x 0.69 0.053 typ 8x 1.35 inch mm 0.387 9.83 0.150 3.81 0.050 1.27 typ
mpxa6115a sensors freescale semiconductor 7 package dimensions case 482-01 issue o small outline package case 482a-01 issue a small outline package s d 8 pl g 4 5 8 1 s b m 0.25 (0.010) a s t -a- -b- n c m j k pin 1 identifier h seating plane -t- dim min max min max millimeters inches a 10.54 0.425 0.415 10.79 b 10.54 0.425 0.415 10.79 c 5.38 0.230 0.212 5.84 d 0.96 0.042 0.038 1.07 g 0.100 bsc 2.54 bsc h 0.002 0.010 0.05 0.25 j 0.009 0.011 0.23 0.28 k 0.061 0.071 1.55 1.80 m 0? 7? 0? 7? n 0.405 0.415 10.29 10.54 s 0.709 0.725 18.01 18.41 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension a and b do not include mold protrusion. 4. maximum mold protrusion 0.15 (0.006). 5. all vertical surfaces 5? typical draft. pin 1 identifier h seating plane -t- w c m j k v dim min max min max millimeters inches a 10.54 0.425 0.415 10.79 b 10.54 0.425 0.415 10.79 c 12.70 0.520 0.500 13.21 d 0.96 0.042 0.038 1.07 g 0.100 bsc 2.54 bsc h 0.002 0.010 0.05 0.25 j 0.009 0.011 0.23 0.28 k 0.061 0.071 1.55 1.80 m 0? 7? 0? 7? n 0.444 0.448 11.28 11.38 s 0.709 0.725 18.01 18.41 v 0.245 0.255 6.22 6.48 w 0.115 0.125 2.92 3.17 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension a and b do not include mold protrusion. 4. maximum mold protrusion 0.15 (0.006). 5. all vertical surfaces 5? typical draft. s d 8 pl g 4 5 8 1 s b m 0.25 (0.010) a t -a- -b- n s
mpxa6115a sensors 8 freescale semiconductor package dimensions case 482c-03 issue b small outline package dim min max min max millimeters inches a 10.54 0.425 0.415 10.79 b 10.54 0.425 0.415 10.79 c 12.70 0.520 0.500 13.21 d 0.66 0.034 0.026 0.864 g 0.100 bsc 2.54 bsc j 0.009 0.011 0.23 0.28 k 0.100 0.120 2.54 3.05 m 0 15 0 15 n 0.444 0.448 11.28 11.38 s 0.540 0.560 13.72 14.22 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension a and b do not include mold protrusion. 4. maximum mold protrusion 0.15 (0.006). 5. all vertical surfaces 5 typical draft. 6. dimension s to center of lead when formed parallel. pin 1 k seating plane ?t? s g 4 5 8 1 ?a? ?b? c n v w m j v 0.245 0.255 6.22 6.48 w 0.115 0.125 2.92 3.17 identifier d 8 pl s b m 0.25 (0.010) a s t detail x detail x
mpxa6115a sensors freescale semiconductor 9 package dimensions case 1369-01 issue b small outline package page 1 of 2
mpxa6115a sensors 10 freescale semiconductor package dimensions case 1369-01 issue b small outline package page 2 of 2
mpxa6115a sensors freescale semiconductor 11 package dimensions case 1317-04 issue f super small outline package page 1 of 3
mpxa6115a sensors 12 freescale semiconductor package dimensions case 1317-04 issue f super small outline package page 2 of 3
mpxa6115a sensors freescale semiconductor 13 package dimensions case 1317-04 issue f super small outline package page 3 of 3
mpxa6115a sensors 14 freescale semiconductor package dimensions case 1317a-04 issue d super small outline package page 1 of 2
mpxa6115a sensors freescale semiconductor 15 package dimensions case 1317a-04 issue d super small outline package page 2 of 2
mpxa6115a rev. 7 05/2011 information in this document is provided solely to enable system and software implementers to use freescale semiconduc tor products. there are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits base d on the information in this document. freescale semiconductor reserves the right to make changes without further notice to any products herein. freescale semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does freescale semiconductor assume any liability ar ising out of the applic ation or use of any product or circuit, and specifically discl aims any and all liability, including without limitation consequential or incidental damages. ?typical? parameters that may be provided in freescale semiconductor data shee ts and/or specifications can and do vary in different applications and actual performance may vary over time. all operating parameters, including ?typicals?, must be validated for each customer application by customer?s technical experts. freescale se miconductor does not convey any license under its patent rights nor the rights of others. freescale semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the fa ilure of the freescale semiconductor product could create a situation where personal injury or death may occur. should buyer purchase or use freescale semiconducto r products for any such unintended or unauthorized application, buyer shall indemnify and hold freescale semiconductor and its officers, employees, subsidiaries, affilia tes, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of pers onal injury or death associated with such unintended or unauthorized use, even if such claim alleges that freescale semiconductor was negligent regarding the design or manufacture of the part. freescale and the freescale logo are trademarks of freescale semiconductor, inc., reg. u.s. pat. & tm. off. all other product or service names are the property of their respective owners. ? freescale semiconductor, in c. 2011. all rights reserved. how to reach us: home page: www.freescale.com web support: http://www.freescale.com/support usa/europe or locations not listed: freescale semiconductor, inc. technical information center, el516 2100 east elliot road tempe, arizona 85284 1-800-521-6274 or +1-480-768-2130 www.freescale.com/support europe, middle east, and africa: freescale halbleiter deutschland gmbh technical information center schatzbogen 7 81829 muenchen, germany +44 1296 380 456 (english) +46 8 52200080 (english) +49 89 92103 559 (german) +33 1 69 35 48 48 (french) www.freescale.com/support japan: freescale semiconductor japan ltd. headquarters arco tower 15f 1-8-1, shimo-meguro, meguro-ku, tokyo 153-0064 japan 0120 191014 or +81 3 5437 9125 support.japan@freescale.com asia/pacific: freescale semiconductor china ltd. exchange building 23f no. 118 jianguo road chaoyang district beijing 100022 china +86 010 5879 8000 support.asia@freescale.com for literature requests only: freescale semiconductor literature distribution center 1-800-441-2447 or +1-303-675-2140 fax: +1-303-675-2150 ldcforfreescalesemiconductor@hibbertgroup.com

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